TIO2 Nanoparticles Reinforced Lead-Free 96.5Sn–3.0Ag–0.5Cu Solder Paste for Ultra-Fine Package Assembly in Reflow Soldering Process
Abstract
Ultra-fine package assembly using TiO2 nanoparticle reinforced lead-free solder paste was carried out in the reflow soldering process. TiO2 nanoparticles were mixed with the SAC solder paste at 0.01, 0.05 and 0.15 wt.%. The ultra-fine package (passive capacitor) was mounted on PCB with a thickness of 2.0 mm using the nanocomposite solders. Voids, microstructure and TiO2 nanoparticle distributions were inspected through the X-ray, SEM and HRTEM. The ultra-fine solder joints were formed perfectly without any void formation. The TiO2 nanoparticles are distributed homogenously in the solder joint. The mechanism of IMC reaction during the reflow soldering process is also discussed. Homogeneous mixing of nanoparticle plays a significant role for the distribution of the nanoparticle in the solder joint.
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References
E.M.N. Ervina and A. Singh, “Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloys”, Soldering & Surface Mount Technology, vol. 26, no. 3, pp. 147–161, 2014.
Y. Tang, G.Y. Li and Y.C. Pan, “Influence of TiO2 nanoparticles on IMC growth in Sn–3.0Ag–0.5Cu–xTiO2 solder”, Journal of Alloys and Compounds, vol. 554, pp. 195-203, 2013.
C.S. Lau, M.Z. Abdullah, C.Y. Khor, “Optimization of the reflow soldering process with multiple quality characteristics in ball grid array packaging by using the grey-based Taguchi method”, Microelectronics International, vol. 30, no. 3, pp. 151-168, 2013.
S.Y. Chang, C.C. Jain, T.H. Chuang, L.P. Feng and L.C. Tsao, “Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder”, Materials and Design, vol. 32, no. 10, pp. 4720-4727, 2011
L.C. Tsao, S.Y. Chang, C.I. Lee, W.H. Sun and C.H. Huang, “Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder”, Materials and Design, vol. 31, no. 10, pp. 4831-4835, 2010.
T. Fouzder, I. Shafiq, Y.C. Chan, A. Sharif and W.K.C. Yung, “Influence of SrTiO3 nanoparticles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads”, Journal of Alloys and Compounds, vol. 509, no. 5, pp. 1885-1892, 2011.
S. Chellvarajoo and M.Z. Abdullah, “Microstructure and mechanical properties of Pb-free Sn–3.0Ag–0.5Cu solder pastes added with NiO nanoparticles after reflow soldering process”, Materials and Design, vol. 90, pp. 499–507, 2016.
S. Chellvarajoo, M.Z. Abdullah and Z. Samsudin, “Effects of Fe2NiO4 nanoparticles addition into lead-free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process”, Materials and Design, vol. 67, pp. 197–208, 2015.
S. Chellvarajoo, M.Z. Abdullah and C.Y. Khor, “Effects of diamond nanoparticles reinforcement into lead-free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process”, Materials & Design, vol. 82, pp. 206–215, 2015.
M.Z. Yahaya, F. Che Ani, Z. Samsudin, S. Sahin, M.Z. Abdullah and A.A. Mohamad, “Hardness profiles of Sn-3.0Ag-0.5Cu-TiO2 composite solder by nanoindentation”, Materials Science and Engineering: A, vol. 669, pp. 178-186, 2016.
M. Abu Bakar, A. Jalar, R. Ismail and A. R. Daud, “Nanoindentation of Sn3.0Ag0.5Cu/ENIG Solder Joint after High Temperature Storage”, Materials Science Forum, vol. 857, pp. 40-43, 2016.
M. Abu Bakar, A. Jalar, A.R. Daud, R. Ismail and N.S. Ibrahim, “Micromechanical properties of solder joint Sn3. 0Ag0. 5Cu on Electroless Nickel immersion gold (ENIG) using Nanoindentation approach”, International Journal of Advanced and Applied Sciences, vol. 3, no. 2, pp. 1-5, 2016.
IPC, 2010. J-STD-001E Joint Industry Standard, in Requirements for Soldered Electrical and Electronic Assemblies. vol. 4, ed Bannockburn, Illinois, USA.
M. Yunus, K. Srihari, J.M. Pitarresi, and A. Primavera, “Effects of voids on the reliability of BGA/CSP solder joints”, Microelectronics Reliability, vol. 43, no. 12, pp. 2077–2086, 2003.
T. Laurila, V. Vuorinen, and J. K. Kivilahti, “Interfacial reactions between lead-free solders and common base materials”, Materials Science and Engineering R, vol. 49, no. 1-2, pp. 1-60, 2005.
M. Reid, J. Punch, M. Collins, and C. Ryan, “Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloys”, Soldering and Surface Mount Technology, vol. 20, no. 4, pp. 3–8, 2008.
