SOLDERING CHARACTERISTICS AND THERMO- MECHANICAL PROPERTIES OF Pb-FREE SOLDER PASTE FOR REFLOW SOLDERING
A deep understanding in thermal characteristics of lead-free solder paste grades is one of the most crucial factors when dealing with reflow soldering process. These temperatures are critical parameters for proper settings of the real reflow process. This report is devoted to discussing the findings obtained during utilization of differential scanning calorimetry (DSC) and calculation using MATLAB to identify the latent heat, solidus and liquidus temperature, and surface tension applicable to numerically simulate the real process of reflow soldering. It can be stated that the equilibrium solidus and liquidus temperatures during solidification process are not a reversal of the melting process, with the solid phase equilibrium occurred at a lower temperature due to the difficulty of ß-Sn nucleation. Amount of heat energy released during solidification differs less than 10% for SAC405 and less than 1% for SAC105 with the latent heat of fusion during the melting process.
J. Bath, Lead-free soldering. New York: Springer, 2011.
G. Henshall, “Lead-Free Alloys for BGA/CSP Components,” in Lead-Free Solder Process Development, 2011, pp. 95–124.
M.-L. Wu and J.-S. Lan, “Reliability and failure analysis of SAC 105 and SAC 1205N lead-free solder alloys during drop test events,” Microelectronics Reliability, vol. 80, pp. 213–222, 2018.
K. N. Subramaniam, Lead-free solders: materials reliability for electronics. Hoboken, NJ: John Wiley & Sons, 2012
G. Henshall, R. Healey, R. S. Pandher, K. Sweatman, K. Howell, R. Coyle, T. Sack, P. Snugovsky, S. Tisdale, F. Hua, and H. Fu, “Addressing industry knowledge gaps regarding new Pb-free solder alloy alternatives,” in 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT), Penang, 2008, pp. 1-12.
B. Bader and C. Richardson, “Selected highlights from the 2017 iNEMI roadmap and projects to address identified gaps,” in Pan Pacific Microelectronics Symposium (Pan Pacific), USA, 2018, pp. 1-13.
B. Bottoms, M. Tsuriya, and C. Richardson, “iNEMI packaging technology roadmap highlights,” in International Conference on Electronics Packaging (ICEP), Japan, 2014, pp. 188-192.
A. Basak, A. Pramanik, H. Riazi, M. Silakhori, and A. Netting, “Development of Pb-Free Nanocomposite Solder Alloys,” Journal of Composites Science, vol. 2, no. 2, pp. 1-9, 2018.
S. Chellvarajoo and M. Abdullah, “Microstructure and mechanical properties of Pb-free Sn–3.0Ag–0.5Cu solder pastes added with NiO nanoparticles after reflow soldering process,” Materials & Design, vol. 90, pp. 499-507, 2016.
M. Kamarudin, A. A. Seman, and N. M. Sharif, “Effect of Aluminium and Silicon to IMC Formation in Low Ag-SAC Solder,” Materials Science Forum, vol. 819, pp. 63–67, 2015.
V. Niranjani, B. C. Rao, R. Sarkar, and S. Kamat, “The influence of addition of nanosized molybdenum and nickel particles on creep behavior of Sn–Ag lead free solder alloy,” Journal of Alloys and Compounds, vol. 542, pp. 136–141, 2012.
Q.B. Tao, L. Benabou, V.N. Le, H. Hwang, and D.B. Lu, "Viscoplastic characterization and post-rupture microanalysis of a novel lead-free solder with small additions of Bi, Sb and Ni," Journal of Alloys and Compounds, vol. 694, pp. 892–904, 2017.
Z. Moser, W. Gasior, A. Debski, and J. Pstrus, “SURDAT - Database of physical properties of lead-free solders,” Journal of Minning and Metallurgy B: Metallurgy, vol. 43, no. 2, pp. 125–130, 2007.
Y.M. Leong and A.S.M.A. Haseeb, “Soldering characteristics and mechanical properties of Sn-1.0Ag-0.5Cu solder with minor aluminum addition,” Materials, vol. 9, no. 7, pp. 1–17, 2016.
O. Krammer, “Modelling the self-alignment of passive chip components during reflow soldering,” Microelectronics Reliability, vol. 54, no. 2, pp. 457–463, 2014.
A.M. Najib, M.Z. Abdullah, A.A. Saad, Z. Samsudin, and F. Che Ani, “Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering,” Microelectronics Reliability, vol. 79, pp. 69–78, 2017.
A.M. Najib, M.Z. Abdullah, C.Y. Khor, and A.A. Saad, “Experimental and numerical investigation of 3D gas flow temperature field in infrared heating reflow oven with circulating fan,” International Journal of Heat and Mass Transfer, vol. 87, pp. 49–58, 2015.
A.M. Najib, M.Z. Abdullah, A.A. Saad, Z. Samsudin and F. Che Ani, “Experimental Study of Self-Alignment during Reflow Soldering Process,” Journal of Advanced Manufacturing Technology, vol. 12, no. 1(2), pp. 355-366, 2018.
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