Experimental Study of Self-Alignment during Reflow Soldering Process
Abstract
Self-alignment forces induced by solder reflow are pivotal to many relevant technologies; including precision micro-objects manipulation and chip component assembly especially in high density interconnect PCB. The primary goal of the study is to investigate the self-alignment effect of different lead-free solder experimentally during reflow soldering process. Results show that the self-alignment capability performs at its best in high silver content solder; SAC405 solder followed by SAC305 and SAC105. However the SN100C has almost similar self-alignment capabilities with the SAC305 solder even without silver trace in the SN100C solder alloy. In conclusion, the silver addition in the lead-free SnCu alloy up to 4 % silver increase surface tension of melted solder which contributed to better self-alignment performance. In the case of SN100C, the micro-alloy of Nickel traced in the SnCu alloy improved fluidity of the alloy during the self-alignment process.
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References
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