MICROELECTRONICS THERMAL DISSIPATION CHARACTERIZATION USING TRIZ
Thermal dissipation of a microelectronic device is a topic of interest amongst the researchers because poor thermal dissipation may cause reliability problem during customer’s application. One of the factors that caused poor thermal dissipation of a device is due to the existence of air gap inside the package. Air gap blocks the heat dissipation path of the device, causing the heat to be entrapped inside the device and to the extent of becoming malfunction. Apparently, X-Ray and SAM are widely used to identify air gap within microelectronic devices. However, these methods are not capable to identify the poor thermal dissipation devices if some weaknesses inherited from wafer processes. Nevertheless, a better way to identify poor thermal dissipation devices is by using electrical measurement which has better advantages compared to X-Ray and SAM in terms of sampling size, time and effort. However, the challenge would be on ensuring the effectiveness of the electrical measurement to identify poor thermal dissipation devices. The problem on electrical measurement effectiveness is best solved by using TRIZ (Theory of Inventive Problem Solving) because TRIZ is a well structure approach to stimulate new idea in solving the effectiveness problem. Functional Model analysis is carried out to observe the interactions of the electrical measurement’s super system, system and sub-system. From the Functional Model and Cause-and-Effect analysis, the root cause for the ineffectiveness of the measurement was determined. Engineering Contradiction statement was formed to identify the improving and worsening parameters. By referring to the Contradiction Matrix, TRIZ proposed to use Parameter Change (PC) as one of the solutions principle to increase the effectiveness of identifying poor thermal dissipation devices. Experiment and data collection confirmed that TRIZ PC principle is able to identify poor thermal dissipation in microelectronic device even though the device did not have air gaps. Such identification was not possible through traditional approaches, such as X-Ray or SAM.
Katsis, D. C., & Daniel, J. “A Thermal, Mechanical, and Electrical Study of Voiding
in the Solder Die-Attach of Power MOSFETs” Components and Packaging
Technologies, Vol. 29, No.1, 127–136. March 2006.
Wolfgang.S. “Void-Detection in Power Transistors for the automotive use”. Master
Thesis, Infineon Technologies AG. 2007.
Schulze, H., Niedernostheide, F., Pfirsch, F., & Baburske, R. ”Limiting Factors
of the Safe Operating Area for Power Devices”, IEEE Transactions on Electron Device,
Vol. 60, No.2, 551–562. February 2013.
T.S. Yeoh, T.J. Yeoh, and C.L. Song. “TRIZ Systematic Innovation In
Manufacturing”. Firstfruits Publisher, Malaysia. 2012.
Chou, J. “Advanced Engineering Informatics An ideation method for generating new product ideas using TRIZ , concept mapping , and fuzzy linguistic evaluation techniques”. Advanced Engineering Informatics, Vol.28, No.4, 441–454. 2014.
Jiang, P., Zhai, J., Chen, Z., & Tan, R. “The Patent Design Around Method Based on TRIZ”, Proceeding 2009 IEEE IEEM, 1067–1071. 2009.
Jin, Y. T., Y. T.S . “TRIZ: Application of Advanced Problem Solving Methodology (ARIZ) in Manufacturing”, International Electronic Manufacturing Technology Conference. 2010.
Xu, C., Guo, X., Jiang, H., & Zhang, Z. “With Temperature Difference Air
Flow Sensor”, International Conference Electronic Packaging Technology, 655–659.
Authors who publish with this journal agree to the following terms:
- Authors transfer copyright to the publisher as part of a journal publishing agreement with the work simultaneously licensed under a Creative Commons Attribution License that allows others to share the work with an acknowledgement of the work's authorship and initial publication in this journal.
- Authors are able to enter into separate, additional contractual arrangements for the non-exclusive distribution of the journal's published version of the work (e.g., post it to an institutional repository or publish it in a book), with an acknowledgement of its initial publication in this journal.
- Authors are permitted and encouraged to post their work online (e.g., in institutional repositories or on their website) after the manuscript is accepted, as it can lead to productive exchanges, as well as earlier and greater citation of published work (See The Effect of Open Access).