Che Ani F, Jalar A, Ismail R, Mustafa Z, Saad A, Khor C, Othman NK, Tura Ali M, Fatah M, Mukhtar M, Abas A. TIO2 Nanoparticles Reinforced Lead-Free 96.5Sn–3.0Ag–0.5Cu Solder Paste for Ultra-Fine Package Assembly in Reflow Soldering Process. JAMT [Internet]. 1 [cited 25Apr.2024];12(1(2):413-24. Available from: https://jamt.utem.edu.my/jamt/article/view/4296