Wong, K.Y., P.J. Liew, K.T. Lau, and J. Wang. “OPTIMIZATION OF COPPER VIA FILLING PROCESS FOR FLEXIBLE PRINTED CIRCUIT USING RESPONSE SURFACE METHODOLOGY”. Journal of Advanced Manufacturing Technology (JAMT) 14, no. 2 (August 28, 2020). Accessed November 23, 2024. https://jamt.utem.edu.my/jamt/article/view/5935.