Abd Rahman, M.N., A.F. Ahmad, Z.S. Hashim, M.R. Muhamad, and E. Budi. “IMPACT OF TaN/Ta BILAYER ON THE BULK RESISTIVITY OF COPPER LAYER AT VARIOUS SELF-ANNEALING TIME”. Journal of Advanced Manufacturing Technology (JAMT) 13, no. 3 (December 31, 2019). Accessed November 25, 2024. https://jamt.utem.edu.my/jamt/article/view/5738.