Abd Rahman, M., A. Ahmad, Z. Hashim, M. Muhamad, and E. Budi. “IMPACT OF TaN/Ta BILAYER ON THE BULK RESISTIVITY OF COPPER LAYER AT VARIOUS SELF-ANNEALING TIME”. Journal of Advanced Manufacturing Technology (JAMT), Vol. 13, no. 3, Dec. 2019, https://jamt.utem.edu.my/jamt/article/view/5738.