Abd Rahman, M., Ahmad, A., Hashim, Z., Muhamad, M. and Budi, E. (2019) “IMPACT OF TaN/Ta BILAYER ON THE BULK RESISTIVITY OF COPPER LAYER AT VARIOUS SELF-ANNEALING TIME”, Journal of Advanced Manufacturing Technology (JAMT), 13(3). Available at: https://jamt.utem.edu.my/jamt/article/view/5738 (Accessed: 20April2024).