Che Ani, F., Jalar, A., Ismail, R., Mustafa, Z., Saad, A., Khor, C., Othman, N. K., Tura Ali, M., Fatah, M., Mukhtar, M. and Abas, A. (1) “TIO2 Nanoparticles Reinforced Lead-Free 96.5Sn–3.0Ag–0.5Cu Solder Paste for Ultra-Fine Package Assembly in Reflow Soldering Process”, Journal of Advanced Manufacturing Technology (JAMT), 12(1(2), pp. 413-424. Available at: https://jamt.utem.edu.my/jamt/article/view/4296 (Accessed: 26April2024).