Kanan, M., Zaimi, M., Manaf, M. and Pham, N. (1) “Quality and Yield Improvement of Barrel Tin Plating Process for SMX Semiconductor Packages”, Journal of Advanced Manufacturing Technology (JAMT), 12(1(2), pp. 79-90. Available at: https://jamt.utem.edu.my/jamt/article/view/4271 (Accessed: 22April2021).