Abd Rahman, M., Ahmad, A., Hashim, Z., Muhamad, M., & Budi, E. (2019). IMPACT OF TaN/Ta BILAYER ON THE BULK RESISTIVITY OF COPPER LAYER AT VARIOUS SELF-ANNEALING TIME. Journal of Advanced Manufacturing Technology (JAMT), 13(3). Retrieved from https://jamt.utem.edu.my/jamt/article/view/5738