Che Ani, F.; Jalar, A.; Ismail, R.; Mustafa, Z.; Saad, A.; Khor, C.; Othman, N. K.; Tura Ali, M.; Fatah, M.; Mukhtar, M.; Abas, A. TIO2 Nanoparticles Reinforced Lead-Free 96.5Sn–3.0Ag–0.5Cu Solder Paste for Ultra-Fine Package Assembly in Reflow Soldering Process. JAMT 1, 12, 413-424.